![]() At the same time, miniaturization of electronics means fewer layers and higher densities-so, less available area for power nets. As voltage is reduced, current requirements typically increase. With low-power design, core voltage levels have continued to drop-1.5V or less is now common. ![]() IR-drop analysis has, however, become quite challenging. How can PCB designers gain useful IR-drop insights quickly from overloaded power integrity (PI) engineers so they can meet stringent time-to-market targets? In this article, we’ll discuss technology that empowers PCB designers with fast access to the same trusted, comprehensive, and accurate IR-drop analysis functions used by the analysis experts.Įnsuring sufficient power delivery in a PCB design, without requiring excess layers or larger board size, is essential. ![]() ![]() Is your PCB design team spending too much time waiting for IR-drop analysis results on the power delivery network (PDN), or trying to optimize the decoupling capacitor network without under- or over-designing it? Given the miniscule voltages of today’s designs, there’s really no margin for error in the PDN. ![]()
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